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Issue

SAP MII (Manufacturing Integration and Intelligence) will stop being supported by SAP after 2027 (or 2030 for extended support). There are currently two MII instances used by Syensqo:

  • Composite ITAR MII (US), is already 100% managed by Syensqo
  • Global MII (based in EU) is currently shared with Solvay, will be cloned

We need to identify a strategy to address this situation. This KDD document presents the possible options and identifies the best proposal, analyzing the implications and impacts under different points of view: Future Proof Solution, Scalability, Best Practice adherence,. 

Three options are available: 

  • A) continue running on MII after end of official support, managing internally or via a 3rd party provider the product maintenance and adaptations
  • B) substitute MII with SAP BTP connectorsIntegration Suite, and connect all MES Systems to S4 via BTP connectorsS/4HANA using the technical objects available in it (BTP Connectors)
  • C) remove MII and directly connect MES systems and Labware/WEBLims to SAP S4 S/4HANA via the current StarTek platform. 


Recommendation

Option B is the recommended solution: substitute MII with SAP BTP connectorsIntegration Suite, and connect all MES Systems to S4 via BTP connectorsand Labware/WEBLims to S/4HANA using the technical objects available in it (BTP Connectors)


Background & Context

MII acts as a middle-ware to connect the MES systems and Labware/WEBLims with the following data flows (not all of them are relevant for all plants/MES systems):

  • process orders from SAP ECC to MES
  • production confirmations from MES to SAP ECC
  • production goods movements from MES to SAP (consumption and goods receipt)

These process are in place for both WP1 (WPX in case of ITAR relevant sites) and PF1. The to-be infrastructure does not foresee an equivalent of the current WPX: https://wiki.syensqo.com/x/8EOYNQ ITAR relevant plants will run in the main S/4 HANA instance

There are no cases of direct user interactions with MII: it is used only as a middle-ware middleware between ECC systems and MES systems.

Data Analytics and Reporting Features (KPI, OEE, Data Intelligence, etc) are not used. This is valid for both MII instances.


Assumptions


Constraints

  • The MII substitution will synchronize with ERP Rebuild go-lives. The new solution will be available for plants running on the new S4 S/4HANA Platform. These Go-Lives may happen in different waves, therefore MII can continue running between waves on a subset of the current plants.


Impacts

  • Conveying the current MII flows via the SAP BTP connectors Integration Suite must be synchronized with the ERP Rebuild go-lives timeline, to optimize the effort and avoid temporary solutions that would be wasted in the long run.
  • The affected plants and MES systems must be prepared to adhere to the unified communication protocol defined by the Star Tek layer, however, this impact is already addressed by the current Star Tek Roll-Out program.SAP Integration Suite


Business Rules

This is a pure techincal KDD, no business impact.


Options considered

Option A: Keep

MII   

MII

In this option we ignore the expiry date of MII maintenance and we keep it running for the current plants and MES systems after it.

The Risk related to this option is the need to build up an internal or 3rd party maintenance team to take care of the system after the SAP maintenance expiry. It is also a non-Future Proof and low-scalable solution. 

This Option implies very little effort both on S4S/HANA 4HANA side and zero effort on current MES systems, as it keeps all current connectors in place as they are.

Pro’s

Con’s

Functionalities: current functions are guaranteed

Future Proof: this solution is not future-proof, as any new functionality, extension, improvement will require bespoke implementation.

 Simplicity: minimal changes required, only to make sure current MII connectors with ECC will work with SAP S/4HANA

Scalability:  the solution will be hardly scalable, as connecting new MES systems and new plants to the current MII instances will require MII skills will become scarce and expensive after the system end of maintenance and dismissal by most of the companies using it.

Effort:   minimal project effort, we just need to guarantee that the custom connectors currently used in the MII-ECC landscape will be adapted to S/4HANA.

 Best Practice: The solution is not on SAP Road Map and does not fit in Best Practices

Functionalities: current functions are guaranteed

Simplicity: minimal changes required, only to make sure current MII connectors with ECC will work with SAP S4/HANA

 


Maintainability: after the expiry date of MII for SAP Maintenance, an internal or 3rd party team must be engaged to keep the product running and maintained.

Effort:  minimal project effort, we just need to guarantee that the custom connectors currently used in the MII-ECC landscape will be adapted to S4.

 

Option B: substitute MII with

Digital Manufactring +

SAP BTP

Digital Manufacturing does not have all functionalities and connectors we had in the MII system. Despite it is the designated substitute of MII, it requires BTP components to fully substitute MII capabilities as MES-SAP middle-ware. Considering this, we think it is a much easier and manageable solution to use directly and only SAP BTP connectors for the interfaces between MES systems and S/4HANA.

There is also a potential risk related to current bespoke implementations in MII to be replicated in DM+the BTP, for this reason the Project Effort is considered to be medium for this option.

This is the option with the best compliance with the SAP standard and Road Map, however it would add further objects to maintain on top of the current Star Tek Layer

It would make sense only if the MES systems was substituted by SAP DM. But, as defined in https://wiki.syensqo.com/x/-YGMNQ, all the current MES systems will remain. 

Pro’s

Pros

Con’s
Cons

Future Proof: this solution is future-proof, as

a single vendor landscape with standard connectors and no bespoke interfaces, any new functionality, extension, improvement will be guaranteed by standard SAP. Scalability

once defined, the BTP connectors maintenance, upgrade and extensions are guaranteed in the long term.

Simplicity: this is a full new implementation and requires a detailed analysis of current connectors, how to replicate them to minimize the impact on the local MES systems.

Scalability:  the solution is scalable, as connecting new MES systems and new plants to the new

DM +

SAP BTP layer will be feasible using standard SAP connectors and APIs

Effort:  maximum project effort for a full new implementation.

Best Practice: The solution

is on SAP Road Map and

fits in SAP Best Practices


Functionalities: we can guarantee  all current MII functions, via

standard

SAP BTP connectors

and potentially a few enhancements of some of them

.

 Simplicity: this is a full new implementation and requires a detailed analysis of current connectors, how to replicate them and potential impacts on MES systems


Maintainability:  the std functionalities

in

SAP

DM and the std connectors in SAP

BTP will require minimal maintenance

effort. Effort:  maximum project

effort

for a full new implementation

.


Option C: Remove MII and directly interface MES systems to the current

Star Tek

StarTek Layer

In this option, we remove MII and we use the Star Tek layer as a middle-ware, to send process/production orders from SAP S4S/HANA 4HANA to MES systems and to collect actual confirmations and production goods movements from MES systems to S4S/HANA4HANA.

It is the option with the minimal impact, as it leverage the current Star Tek solution implementation effort. It is based on bespoke interfaces, however the scalability and future-proof of the solution are guaranteed by the Star Tek design, that defined a single standard communication protocol for all different MES systems used in Syensqo. 

This option requires that the timeline of the current Star Tek roll out program assures that all plants currently served by MII will move to the Star Tek platform before the MII end of maintenance period. 

Pro’s

Con’s

Future Proof: this solution is considered

good Best Practice: The solution is not on SAP Road Map and does not fit SAP Best Practices

decent from a future-proof, as any new functionality, extension, improvement will be guaranteed by the standardization introduced by the Star Tek Layer. However, is slightly less valuable than option B.

 Scalability: the solution is scalable, as connecting new MES systems and new plants to the new DM + SAP BTP layer will be feasible using the standard protocols defined by the Star Tek layer

Scalability:  as the Star Tek layer is not a proper Middle-ware software, even though the functional scalability looks good, we technically consider the scalability of this solution very poor.

Functionalities: Star Tek is already in place and connecting several MES systems in different plants, all its functionalities are guaranteed by this approach.

Best Practice: The solution is not on SAP Road Map and does not fit SAP Best Practices

Simplicity: no changes required, simply the current Star Tek Roll Out program goes on while the ERP Rebuild project must guarantee the compatibility of the current ECC-Star Tek connections with the new

S4

S/

HANA

4HANA - Star Tek landscape.

Maintainability:

 the std functionalities in SAP DM and the std connectors in SAP BTP will require minimal maintenance effort, while custom connectors may cause an increase of it

Dedicated maintenance for the bespoke interfaces between the different MES systems, the Star Tek layer and SAP would be required

Effort:  small

 Effort:  minimal

project effort as Star Tek roll outs are already foreseen and adaptation of current Star Tek - ECC interfaces to

S4 HANA is a pure technical porting (CCM - Custom Code Migration)

S/4HANA would be relatively simple


Evaluation

The following Matrix matrix illustrates the evaluation of each option under the considered criteria:

Criteria

Weight 

Option A

Keep MII

Option B:

substitute

Substitute MII with

DigitalManufacturing + BTP

SAP BTP Integration Suite

Option C:

Remove MII and use

Star Tek layer

StarTek as middleware

Future ProofVH Very Low Very High
High
Medium
ScalabilityH  Low  Very High
 Very High
 Very Low
Best PracticeM Very Low Very High Very Low
Functionalities VH Very High Very High
Very
High
SimplicityH Very High Low Very High
MaintainabilityVH Very Low Very High
High
Low
Reduce Project EffortVH Very High
Very
Low
Very
High

Total 


Medium

Medium/

High

High

Medium


Change log

Change History
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Workflow history

Workflow Report
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