| APPLICATIONS |
|---|
THEORY, KNOWLEDGE, & MODELS |
|---|
| CAPABILITIES |
|---|
Electronics | IC substrate manufacturing |
|---|---|
Film formation | Multi-layer film manufacturing |
Theory | Multi-layer film forming |
Process | Hot Press |
Material | Polyimide |
| Cu Foil | |
| Prepreg | |
Simulation (VE) | bending of FCCL |
| Core Equipments at ADL Ewha Site |
|---|
Hot Press Machine |
| Core Competitiveness at ADL Ewha |
|---|
| Evaluation Data Library |
|---|
| Project History |
|---|
| Commercialized products | |
| Customized Products |
| No | Project Title |
|---|---|
| 1 | Flexible Copper Clad Laminate development |
| 2 | |
| 3 |