Meet the customer requirements
: 20um hole pattern resolution implemented based on the formulation tuning
: Holes fully opened down to 20um without residues on bottom side.
SYENSQO developed backbone resin shows a similar pattern performance when compared with competitors products
Product A | Product B | SYENSQO S-3000 | ||
Coating RPM | 1650rpm for 15um | 900RPM for 15um | 800RPM for 20um | |
Softbake | 4min @ 100℃ | 5min @ 110℃ | 3min @ 70oC | |
UV exposure | Broadband: 450mJ/cm2 | Broadband: 300mJ/cm2 | Broadband: 500mJ/cm2 | |
PEB | No | 60sec@50℃ | 1min @ 90oC | |
Develop | Time | 45sec dipping | 45sec dipping | 90sec dipping |
developer | CP | |||
Rinse | 15sec @ PGMEA | 20sec @ PGMEA | ||
Thickness after dev. | 13.9um | 13.5um | 13.3um | |
Hardbake | 1. 50℃ to 110℃ during 12min 2. 30min@110℃ Hold 3. 110℃~250℃ during 28min 4. 120min@250℃ Hold | 1. 50℃ to 150℃ : 5℃/min 2. 30min@150℃ Hold 3. 150℃ to 230℃ : 5℃/min 4. 3hr @230℃ Hold | 1. 50℃ to 150℃ : 5℃/min 2. 30min@150℃ Hold 3. 150℃ to 230℃ : 5℃/min 4. 3hr @230℃ Hold | |
Final Thickness | 8.9 um | 9.4um | 10um | |
Max. pattern Resolution : 20um | Max. pattern Resolution : 30um | Max. pattern Resolution : 25um | ||
