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Main Applications
Theory of Process and Materials
CAPABILITIES

Semiconductor

1. Electronic circuit formation

2. Dielectric layer formation

Display

1.  Transistor and color filter

2. RGB layer formation (Color Resist)


TheoryPatterningPhotolithography
Process
Coating
  1. Spin coating
  2. Softbake
UV exposure
  1. Mask alignment
  2. UV Exposure
Develop 
  1. Develop
Materials
  1. General Photoresist
  2. Photo sensitive Polyimide

1. Formulation

2. Spin coating on Substrate

3. Mask Alignment and UV Exposure


Best Practice Case








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